ZT: 大复活, 力晶砸百亿提升制程

发布时间:2010-3-10 09:45    发布者:步从容
关键词: 复活 , 制程
2010-03-10 工商时报【记者李淑惠/台北报导】
    力晶通过今年度的资本支出计画,预计在转入40奈米制程之下,2010年度的资本支出将达100亿元至110亿元,与去年度几乎没有资本支出相较,呈现巨幅成长。如果加上力晶转投资瑞晶的资本支出120亿元,以及尔必达(Elpida)的600亿日圆(212亿元),泛尔必达联盟2010年资本出合计432亿元,攀上近年高峰。

    DRAM厂今年没有新厂加入营运,在微软Win7带动的换机潮涌现,以及美商苹果相继推出新产品之下,今年DRAM供给有限成为市场共识,大厂沉寂已久的资本支出计画也相继浮现。

    力晶董事会昨(9)日通过2010年的资本支出计画,力晶表示,资本支出规模落在100亿元至110亿元,主要还是用在转进40奈米制程,去年度则因为上半年景气仍旧不佳,几乎没有资本支出。

    力晶去年股东会时已经事先通过12亿股额度之内,办理现金增资,力晶有意在今年上半年完成该笔现增,对改善财务结构、每股净值有相当程度帮助,惟力晶目前股本已高达873亿元,若以现增方式筹资,恐有股本膨胀之嫌。

    今年国内外的DRAM厂都有大幅度的资本支出,除力晶、瑞晶已经公布之外,南科原定今年资本支出为190亿元,然因南科规划将12吋厂产能从3.6万片增至5万片,产能增幅高达39%,因此今年度的资本支出可望超越200亿元大关;同一集团的华亚科因提前导入42奈米制程,今年度的资本支出也从450亿元上修至520亿元,资本支出规模高居国内DRAM厂之冠。

    从厂商在资本支出的规画上来看,今年有相当程度的资本支出投入40奈米,力晶、瑞晶以45奈米为主,而南科、华亚科则提前一季导入42奈米,显见景气好转不仅让厂商恢复生机,也让国内DRAM厂的40奈米竞争白热化。
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步从容 发表于 2010-3-10 09:50:00
SanDisk begins to supply NAND flash wafers, say memory module makers
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Josephine Lien, Taipei; Jessie Shen, DIGITIMES [Tuesday 9 March 2010]

Taiwan-based NAND flash device makers including A-Data Technology, Transcend Information and Power Quotient International (PQI), and flash controller supplier Phison Electronics have begun to source NAND flash wafers from SanDisk, according to industry sources.

The sources claimed SanDisk has now become one of these players' upstream suppliers, along with its partner Toshiba. Speculation about SanDisk mulling changes to its strategy to sell NAND flash in wafer or die form has been circulating in the Taiwan memory sector since September 2008.

SanDisk is also looking to withdraw or settle NAND flash-related patent infringement lawsuits in the US against those Taiwan-based NAND flash device and controller chip makers who have become its customers, the sources said.

A-Data has issued a company filing with the Taiwan Stock Exchange (TSE) disclosing SanDisk has dropped a patent lawsuit against it. The announcement follows Phison's recent filing with the TSE indicating it has settled with SanDisk over a patent suit filed in the same US court.

SanDisk reportedly has also tapped the white-box market by supplying microSD cards to downstream device makers.
步从容 发表于 2010-3-10 09:50:58
Chip equipment spending to grow 76% in 2010, says Gartner
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Press release; Jessie Shen, DIGITIMES [Tuesday 9 March 2010]
2009 2010(e) 2011(f)  2012(f)  2013(f)   2014(f)
Semiconductor capital spending   25,934.9    40,429.9 51,291.5 61,898.6 54,167.5   52,953.2
Y/Y    -41.1% 55.9% 26.9%   20.7% -12.5% -2.2%
Capital equipment 16,677.1 29,372.6 36,413.3 42,919.6 35,694.2 35,965.5
Y/Y -45.6% 76.1% 24.0% 17.9% -16.8% 0.8%
Wafer fab equipment   12,976.8 22,924.7 28,793.3 34,351.3 29,176.7 28,581.6
Y/Y    -46.4%   76.7% 25.6% 19.3% -15.1% -2.0%
Packaging and assembly equipment   2,382.6 4,181.7 5,013.2 5,716.4 4,335.5 4,977.0
Y/Y    -40.4% 75.5% 19.9% 14.0% -24.2% 14.8%
Automated test equipment   1,317.7 2,266.2 2,606.8 2,851.9 2,182.1 2,406.8
Y/Y    -46.1% 72.0% 15.0% 9.4% -23.5% 10.3%
Other spending    9,257.8 11,057.3 14,878.2 18,979.0 18,473.3 16,987.8
  Y/Y   
-30.8% 19.4% 34.6% 27.6% -2.7%  -8.0%
Gartner: Global chip equipment spending forecast, 2009-2014 (US$m)
Source: Gartner, compiled by Digitimes, March 2010

Worldwide semiconductor capital equipment spending is projected to surpass US$29.4 billion in 2010, a 76.1% rise from 2009 spending of US$16.7 billion, according to Gartner.

"The dramatic semiconductor industry recovery rate over the last three quarters has necessitated a renewed growth for equipment spending," said Jim Walker, research vice president at Gartner. "Spending by the memory and foundry markets, along with the advancement to new technology nodes, will drive the semiconductor equipment segment in the first half of 2010. Quarterly growth will see a slight slowdown in the second half before capacity additions start ramping up the equipment industry again going into 2011."

Gartner estimated wafer fab equipment spending is set to grow 76.6% in 2010, following a 46.4% decline in 2009. The growth will be driven by aggressive technology upgrades, especially for the leading memory companies.

Packaging and assembly equipment (PAE) spending is forecast to increase by more than 75% in 2010, according to Gartner, adding that the growth is expected through 2012. The modest decline expected for 2013 is based on a more traditional inventory-based market contraction, the firm said.

On a regional basis, Gartner believes Asia Pacific will improve its share of PAE consumption throughout the forecast period. The region will account for nearly 85% of all PAE sales by 2014. China will be the largest individual consumer of PAE in 2012, accounting for nearly 27% of the total market that year.

According to Gartner, 2010 will also bring the worldwide automated test equipment (ATE) market its first positive growth year since 2006. After bottoming out in the first quarter of 2009, the ATE market has realized substantial quarterly gains and is expected to grow by more than 70% in 2010. Growth is expected to continue during the next several quarters as device demand improves, said Gartner, adding that its 2010 growth expectations are driven heavily by the expected transition to DDR3 memory devices.

"The semiconductor equipment industry will experience a very strong growth spurt in 2010, as we emerge from a very costly recession, and this growth is expected to continue throughout 2012," said Walker. "However, we expect this upturn to be one of the first in which the peak revenue in capital equipment does not surpass previous growth cycles, which may well help to mitigate the boom/bust scenario that we have seen in the past."
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