PCB设计中专业英译术语之基材
发布时间:2018-4-28 11:18
发布者:板儿妹0517
PCB设计中专业英译术语之基材: 1. 基材:base material 2. 层压板:laminate 3. 覆金属箔基材:metal-clad bade material 4. 覆铜箔层压板:copper-clad laminate (CCL) 5. 单面覆铜箔层压板:single-sided copper-clad laminate 6. 双面覆铜箔层压板:double-sided copper-clad laminate 7. 复合层压板:composite laminate 8. 薄层压板:thin laminate 9. 金属芯覆铜箔层压板:metal core copper-clad laminate 10. 金属基覆铜层压板:metal base copper-clad laminate 11. 挠性覆铜箔绝缘薄膜:flexible copper-clad dielectric film 12. 基体材料:basis material 13. 预浸材料:prepreg 14. 粘结片:bonding sheet 15. 预浸粘结片:preimpregnated bonding sheer 16. 环氧玻璃基板:epoxy glass substrate 17. 加成法用层压板:laminate for additive process 18. 预制内层覆箔板:mass lamination panel 19. 内层芯板:core material 20. 催化板材:catalyzed board ,coated catalyzed laminate 21. 涂胶催化层压板:adhesive-coated catalyzed laminate 22. 涂胶无催层压板:adhesive-coated uncatalyzed laminate 23. 粘结层:bonding layer 24. 粘结膜:film adhesive 25. 涂胶粘剂绝缘薄膜:adhesive coated dielectric film 26. 无支撑胶粘剂膜:unsupported adhesive film 27. 覆盖层:cover layer (cover lay) 28. 增强板材:stiffener material 29. 铜箔面:copper-clad surface 30. 去铜箔面:foil removal surface 31. 层压板面:unclad laminate surface 32. 基膜面:base film surface 33. 胶粘剂面:adhesive faec 34. 原始光洁面:plate finish 35. 粗面:matt finish 36. 纵向:length wise direction 37. 模向:cross wise direction 38. 剪切板:cut to size panel 39. 酚醛纸质覆铜箔板:phenolic cellulose paper copper-clad laminates(phenolic/paper CCL) 40. 环氧纸质覆铜箔板:epoxide cellulose paper copper-clad laminates (epoxy/paper CCL) 41. 环氧玻璃布基覆铜箔板:epoxide woven glass fabric copper-clad laminates 42. 环氧玻璃布纸复合覆铜箔板:epoxide cellulose paper core, glass cloth surfaces copper-clad laminates 43. 环氧玻璃布玻璃纤维复合覆铜箔板:epoxide non woven/woven glass reinforced copper-clad laminates 44. 聚酯玻璃布覆铜箔板:ployester woven glass fabric copper-clad laminates 45. 聚酰亚胺玻璃布覆铜箔板:polyimide woven glass fabric copper-clad laminates 46. 双马来酰亚胺三嗪环氧玻璃布覆铜箔板:bismaleimide/triazine/epoxide woven glass fabric copper-clad lamimates 47. 环氧合成纤维布覆铜箔板:epoxide synthetic fiber fabric copper-clad laminates 48. 聚四乙烯玻璃纤维覆铜箔板:teflon/fiber glass copper-clad laminates 49. 超薄型层压板:ultra thin laminate 50. 陶瓷基覆铜箔板:ceramics base copper-clad laminates 51. 紫外线阻挡型覆铜箔板:UV blocking copper-clad laminates 以上即是PCB设计中专业英译术语之基材,下期预告:PCB设计中专业英译术语之基材的材料,更多更多行业信息可查阅快点学院订阅号:eqpcb_cp。 ![]() |
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