Regular Fabrics in Deep Sub-Micron Integrated-Circuit Design

发布时间:2010-7-8 16:25    发布者:techieboy
关键词: 集成电路 , 亚微米
Regular Fabrics in Deep Sub-Micron Integrated-Circuit Design  discusses new approaches to better timing-closure and manufacturability of DSM Integrated Circuits. The key idea presented is the use of regular circuit and interconnect structures such that area/delay can be predicted with high accuracy. The co-design of structures and algorithms allows great opportunities for achieving better final results, thus closing the gap between IC and CAD designers. The regularities also provide simpler and possibly better manufacturability.

In this book we present not only algorithms for solving particular sub-problems but also systematic ways of organizing different algorithms in a flow to solve the design problem as a whole. A timing-driven chip design flow is developed based on the new structures and their design algorithms, which produces faster chips in a shorter time.

Written for:
CAD developers, IC designers, engineers and developers in the area of IC fabrication and IC reliability

4.jpg

Regular Fabrics in Deep Sub-Micron Integrated-Circuit Design.part1.rar (4.67 MB)
Regular Fabrics in Deep Sub-Micron Integrated-Circuit Design.part2.rar (4.67 MB)
Regular Fabrics in Deep Sub-Micron Integrated-Circuit Design.part3.rar (4.67 MB)
Regular Fabrics in Deep Sub-Micron Integrated-Circuit Design.part4.rar (4.45 MB)
本文地址:https://www.eechina.com/thread-14772-1-1.html     【打印本页】

本站部分文章为转载或网友发布,目的在于传递和分享信息,并不代表本网赞同其观点和对其真实性负责;文章版权归原作者及原出处所有,如涉及作品内容、版权和其它问题,我们将根据著作权人的要求,第一时间更正或删除。
mdtjason 发表于 2010-10-24 23:46:01
thanks~~
您需要登录后才可以发表评论 登录 | 立即注册

厂商推荐

相关视频

关于我们  -  服务条款  -  使用指南  -  站点地图  -  友情链接  -  联系我们
电子工程网 © 版权所有   京ICP备16069177号 | 京公网安备11010502021702
快速回复 返回顶部 返回列表