PCB设计中专业英译术语之形状与尺寸

发布时间:2018-5-11 17:55    发布者:板儿妹0517
关键词: pcb设计 , 英译术语 , 形状与尺寸 , allgro , pcb设计培训
  1.开料:CutLamination/Material cutting
  2.钻孔:Drilling
  3.内钻:Inner LayerDrilling
  4一次孔:Outer Layer Drilling
  5.二次孔:2nd Drilling
  6.雷射钻孔aser Drilling /Laser Ablation
  7.()孔钻孔:Blind & Buried Hole Drilling
  8.干膜制程:PhotoProcess(D/F)/Dry Film
  9.前处理 (Pretreatment)
  10.压膜ry Film Lamination
  11.曝光:Exposure
  12.显影eveloping
  13.去膜:Stripping
  14.压合:Lamination
  15:黑化:Black OxideTreatment
  16.微蚀:Microetching
  17.铆钉组合:eyelet
  18.迭板ay up
  19.压合amination
  20.后处理ost Treatment
  21.黑氧化:Black Oxide Removal
  22.铣靶:spot face
  23.去溢胶:resin flush removal
  24.减铜:Copper Reduction
  25.水平电镀:HorizontalElectrolytic Plating
  26.电镀:Panel plating
  27.锡铅电镀:Tin-Lead Plating /Pattern Plating
  28.低于 1 mil: Less than 1 mil Thickness
  29.高于 1 mil:More than 1 mil Thickness
  30.砂带研磨:Belt Sanding
  31:剥锡铅:Tin-Lead Stripping
  32.微切片: Microsection
  33.蚀铜:Etching
  34.初检:Touch-up
  35.塞孔:Plug Hole
  36.防焊(绿漆/绿油)SolderMask
  37.C面印刷rinting Top Side
  38.S面印刷rinting Bottom Side
  39.静电喷涂:Spray Coating
  40.前处理retreatment
  41.预烤recure
  42.后烘烤ostcure
  43.印刷:Ink Print
  44.表面刷磨:Scrub
  45.后烘烤ostcure
  46.UV烘烤:UV Cure
  47.文字印刷rinting of Legend
  48.喷砂umice/Wet Blasting
  49.印可剥离防焊/蓝胶eelable Solder Mask)
  50.化学前处理,化学研磨:Chemical Milling
  51.选择性浸金压膜:Selective Gold Dry Film Lamination
  52.镀金:Gold plating
  53.喷锡:Hot Air SolderLeveling
  54.成型:Profile/Form
  55.开短路测试:Electrical Testing
  56.终检:Final VisualInspection
  57.金手指镀镍金:Gold Finger
  58.电镀软金:Soft Ni/Au Plating
  59.浸镍金:Immersion Ni/Au / Electroless Ni/Au
  60.喷锡:Hot Air Solder Leveling
  61.水平喷锡:HorizontalHot Air Solder Leveling
  62.垂直喷锡: Vertical Hot Air Solder Leveling
  63.超级焊锡:Super Solder
  64.印焊锡突点:Solder Bump
  65.数控铣/锣板:N/C Routing/Milling
  66.模具冲/啤板:Punch
  67.板面清洗烘烤:Cleaning & Backing
  68.V型槽/V-CUTV-Cut/V-Scoring
  69.金手指斜边:Beveling of G/F
  70.短断路测试Electrical Testing/Continuity & Insulation Testing
  71.AOI 光学检查:AOI Inspection
  72VRS 目检:Verified & Repaired
  73.泛用型治具测试:Universal Tester
  74.专用治具测试:Dedicated Tester
  75.飞针测试:Flying Probe
  76.终检:Final Visual Inspection
  77.压板翘:Warpage Remove
  78.X-OUT 印刷:X-Out Marking
  79.包装及出货:Packing& shipping
  80.清洗及烘烤: Final Clean & Baking
  81.铜面保护剂:ENTEK Cu-106A/OSP
  82.离子残余量测试:Ionic Contamination Test/ Cleanliness Test
  83.冷热冲击试验:Thermal cycling Testing
  84.焊锡性试验:Solderability Testing
  85.雷射钻孔aser Ablation
  86.雷射钻Toolingaser ablationTooling Hole
  87.雷射曝光对位孔aser Ablation Registration Hole
  88.雷射Mask制作aser Mask
  89.雷射钻孔aser Ablation
  90.AOI检查及VRS:AOI Inspection & Verified & Repaired
  91.除胶渣esmear
  92.专用治具测试edicated Tester
  93.飞针测试:Flying Probe
  94.压板翘: Warpage Remove
  95.底片:Ablation
  96.烧溶:laser)
  97./磨:abrade
  98.粗化:abrasion
  99.耐磨性:absorption resistance
  100.允收:ACC /accept
  101.加速腐蚀:accelerated corrosion test
  102加速试验:accelerated test
  103.速化反应:acceleration
  104.加速剂:accelerator
  105.允许:acceptable
  106.活化液:activator
  107.实际在制品:active work in process
  108.附着力:adhesion
  109.黏着法:adhesive method
  110.气泡:air inclusion
  111.风刀:air knife
  112.不定形的改变:amorphous change
  113.总量:amount
  114.硝基戊烷:amylnitrite
  115.分析仪:analyzer
  116环状垫圈;孔环annular ring
  117.阳极泥:anodeslime (sludge)
  118.阳极清洗:anodizing
  119.自动光学检测:AOI/automatic optical inspection
  120.引用之文件:applicable documents
  121.允收水平抽样:AQL sampling
  122.液态光阻:aqueous photoresist
  123.纵横比(厚宽比)aspect ratioAs received
  124.背光:back lighting
  125.垫板:back-up
  126.预留在制品:banked work in process
  127.基材:base material
  128.基准绩效:baseline performance
  129.批:batch
  130.贝他射线照射法:beta backscattering
  131.切斜边;斜边:beveling
  132.二方向之变形:biaxial deformation
  133.黑化:black-oxide
  134.空板:blank panel
  135.挖空:blanking
  136.弹开:blip
  137.气泡:blister blistering
  138.吹孔:blow hole
  139.板厚错误:board-thickness error
  140.黏结层:bonding plies
  141.板弯:bow ; bowing
  142.破空:break out
  143.搭桥;桥接:bridging
  144.接单生产:BTO (Build To Order)
  145,.烧焦:burning
  146.毛边(毛头)burr
  147.碳化物:carbide
  148.定位梢:carlson pin
  149.载运剂:carrier
  150.催化:catalyzing
  151.阴极溅射法:catholicsputtering
  152.隔板;钢板:caul plate
  153.校验系统之各种要求:calibration system requirements
  154.中心光束法:center beam method
  155.集中式投射线:central projection
  156.认证:certification
  157.倒角 (金手指)chamfer chamfer
  158.切斜边;倒角:chamfering
  159.特性阻抗:characteristic impedance
  160.电量传递过电压charge transfer overpotential
  161.网框:chase
  162.棋盘:checkboard
  163.蟹和剂:chelator
  164.化学键:chemical bond
  165.化学蒸着镀:chemical vapor deposition
  166.圆周性之孔破:circumferential void
  167.包夹金属:clad metal
  168.无尘室:clean room
  169.间隙:clearance
170.表面处理:Coating/Surface Finish
上即是pcb设计中专业英译术语之形状与尺寸,下期预告:PCB设计中专业英译术语之流程,更多更多行业信息可查阅快点学院订阅号:eqpcb_cp。
快点PCB学院二维码.jpg

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