PCB设计中专业英译术语之形状与尺寸

发布时间:2018年05月11日 17:05    作者:板儿妹0517
关键词: pcb设计 , 英译术语 , 形状与尺寸 , allgro , pcb设计培训

  1.开料:CutLamination/Material cutting

  2.钻孔:Drilling

  3.内钻:Inner LayerDrilling

  4一次孔:Outer Layer Drilling

  5.二次孔:2nd Drilling

  6.雷射钻孔aser Drilling /Laser Ablation

  7.()孔钻孔:Blind & Buried Hole Drilling

  8.干膜制程:PhotoProcess(D/F)/Dry Film

  9.前处理 (Pretreatment)

  10.压膜ry Film Lamination

  11.曝光:Exposure

  12.显影eveloping

  13.去膜:Stripping

  14.压合:Lamination

  15:黑化:Black OxideTreatment

  16.微蚀:Microetching

  17.铆钉组合:eyelet

  18.迭板ay up

  19.压合amination

  20.后处理ost Treatment

  21.黑氧化:Black Oxide Removal

  22.铣靶:spot face

  23.去溢胶:resin flush removal

  24.减铜:Copper Reduction

  25.水平电镀:HorizontalElectrolytic Plating

  26.电镀:Panel plating

  27.锡铅电镀:Tin-Lead Plating /Pattern Plating

  28.低于 1 mil: Less than 1 mil Thickness

  29.高于 1 mil:More than 1 mil Thickness

  30.砂带研磨:Belt Sanding

  31:剥锡铅:Tin-Lead Stripping

  32.微切片: Microsection

  33.蚀铜:Etching

  34.初检:Touch-up

  35.塞孔:Plug Hole

  36.防焊(绿漆/绿油)SolderMask

  37.C面印刷rinting Top Side

  38.S面印刷rinting Bottom Side

  39.静电喷涂:Spray Coating

  40.前处理retreatment

  41.预烤recure

  42.后烘烤ostcure

  43.印刷:Ink Print

  44.表面刷磨:Scrub

  45.后烘烤ostcure

  46.UV烘烤:UV Cure

  47.文字印刷rinting of Legend

  48.喷砂umice/Wet Blasting

  49.印可剥离防焊/蓝胶eelable Solder Mask)

  50.化学前处理,化学研磨:Chemical Milling

  51.选择性浸金压膜:Selective Gold Dry Film Lamination

  52.镀金:Gold plating

  53.喷锡:Hot Air SolderLeveling

  54.成型:Profile/Form

  55.开短路测试:Electrical Testing

  56.终检:Final VisualInspection

  57.金手指镀镍金:Gold Finger

  58.电镀软金:Soft Ni/Au Plating

  59.浸镍金:Immersion Ni/Au / Electroless Ni/Au

  60.喷锡:Hot Air Solder Leveling

  61.水平喷锡:HorizontalHot Air Solder Leveling

  62.垂直喷锡: Vertical Hot Air Solder Leveling

  63.超级焊锡:Super Solder

  64.印焊锡突点:Solder Bump

  65.数控铣/锣板:N/C Routing/Milling

  66.模具冲/啤板:Punch

  67.板面清洗烘烤:Cleaning & Backing

  68.V型槽/V-CUTV-Cut/V-Scoring

  69.金手指斜边:Beveling of G/F

  70.短断路测试Electrical Testing/Continuity & Insulation Testing

  71.AOI 光学检查:AOI Inspection

  72VRS 目检:Verified & Repaired

  73.泛用型治具测试:Universal Tester

  74.专用治具测试:Dedicated Tester

  75.飞针测试:Flying Probe

  76.终检:Final Visual Inspection

  77.压板翘:Warpage Remove

  78.X-OUT 印刷:X-Out Marking

  79.包装及出货:Packing& shipping

  80.清洗及烘烤: Final Clean & Baking

  81.铜面保护剂:ENTEK Cu-106A/OSP

  82.离子残余量测试:Ionic Contamination Test/ Cleanliness Test

  83.冷热冲击试验:Thermal cycling Testing

  84.焊锡性试验:Solderability Testing

  85.雷射钻孔aser Ablation

  86.雷射钻Toolingaser ablationTooling Hole

  87.雷射曝光对位孔aser Ablation Registration Hole

  88.雷射Mask制作aser Mask

  89.雷射钻孔aser Ablation

  90.AOI检查及VRS:AOI Inspection & Verified & Repaired

  91.除胶渣esmear

  92.专用治具测试edicated Tester

  93.飞针测试:Flying Probe

  94.压板翘: Warpage Remove

  95.底片:Ablation

  96.烧溶:laser)

  97./磨:abrade

  98.粗化:abrasion

  99.耐磨性:absorption resistance

  100.允收:ACC /accept

  101.加速腐蚀:accelerated corrosion test

  102加速试验:accelerated test

  103.速化反应:acceleration

  104.加速剂:accelerator

  105.允许:acceptable

  106.活化液:activator

  107.实际在制品:active work in process

  108.附着力:adhesion

  109.黏着法:adhesive method

  110.气泡:air inclusion

  111.风刀:air knife

  112.不定形的改变:amorphous change

  113.总量:amount

  114.硝基戊烷:amylnitrite

  115.分析仪:analyzer

  116环状垫圈;孔环annular ring

  117.阳极泥:anodeslime (sludge)

  118.阳极清洗:anodizing

  119.自动光学检测:AOI/automatic optical inspection

  120.引用之文件:applicable documents

  121.允收水平抽样:AQL sampling

  122.液态光阻:aqueous photoresist

  123.纵横比(厚宽比)aspect ratioAs received

  124.背光:back lighting

  125.垫板:back-up

  126.预留在制品:banked work in process

  127.基材:base material

  128.基准绩效:baseline performance

  129.批:batch

  130.贝他射线照射法:beta backscattering

  131.切斜边;斜边:beveling

  132.二方向之变形:biaxial deformation

  133.黑化:black-oxide

  134.空板:blank panel

  135.挖空:blanking

  136.弹开:blip

  137.气泡:blister blistering

  138.吹孔:blow hole

  139.板厚错误:board-thickness error

  140.黏结层:bonding plies

  141.板弯:bow ; bowing

  142.破空:break out

  143.搭桥;桥接:bridging

  144.接单生产:BTO (Build To Order)

  145,.烧焦:burning

  146.毛边(毛头)burr

  147.碳化物:carbide

  148.定位梢:carlson pin

  149.载运剂:carrier

  150.催化:catalyzing

  151.阴极溅射法:catholicsputtering

  152.隔板;钢板:caul plate

  153.校验系统之各种要求:calibration system requirements

  154.中心光束法:center beam method

  155.集中式投射线:central projection

  156.认证:certification

  157.倒角 (金手指)chamfer chamfer

  158.切斜边;倒角:chamfering

  159.特性阻抗:characteristic impedance

  160.电量传递过电压charge transfer overpotential

  161.网框:chase

  162.棋盘:checkboard

  163.蟹和剂:chelator

  164.化学键:chemical bond

  165.化学蒸着镀:chemical vapor deposition

  166.圆周性之孔破:circumferential void

  167.包夹金属:clad metal

  168.无尘室:clean room

  169.间隙:clearance

170.表面处理:Coating/Surface Finish

上即是pcb设计中专业英译术语之形状与尺寸,下期预告:PCB设计中专业英译术语之流程,更多更多行业信息可查阅快点学院订阅号:eqpcb_cp。

快点PCB学院二维码.jpg


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