【日月光ASESH招聘】Manufacture Process Engineering Director 上海
发布时间：2015-12-31 15:20
发布者：moore100
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日月光封装测试（上海）有限公司 Manufacture Process Engineering Director 25K-35K 上海 10年以上 本科及以上 全职 职位诱惑: 良好的展平台、优沃的工作绩效奖金 职位描述： ob Description: 1.Lead an engineering team (60 to 70 engineers) to perform process and product qualifications for Lead Frame Type、PBGA packages 2.Work with Station & Manufactory PE team to implement new processes and products into production line 3.Work with customer to understand the customer requirements and to implement them in the process 4.Take in charge of conducting process evaluations and preparing reports including,FMEA, DOE(process windows), failure analysis and process specs. 5.Take in charge of engineering supports for Production sustaining. 6.Strong experience should be in the areas of Molding, laser scribing and laser marking for SiP packages. Qualification: 【Education Background】 1.BS degree or above in related engineering majors 2.Excellent interpersonal and communications skills in both Chinese & English 【Working Experiences】 1.10 to 15 year experience in electronic packaging, engineering and manufacturing management. 2.Packaging back-end experiences are required, such as molding, laser marking / trimming / singulation, experience in SMT is a plus. 3.Experiences to work with English speaking customers. 【Requirements】 1.Project Management Skill 2.Communications skills in both Chinese & English 3.Strong multi-task skills and detail oriented 4.Able to work under pressure and complex environment 公司介绍： 日月光集团为全球第一大半导体制造服务公司，长期提供全球客户最佳的服务与最先进的技术。自1984年成立至今，专注于提供半导体客户完整的封装与测试服务，包括芯片前段测试及晶圆针测至后段之封装、材料及成品测试的一元化服务。全球营运据点涵盖台湾、韩国、日本、马来西亚、新加坡、中国、美国与欧洲多个国家与地区，全球员工人数超过三万人，2007年营业收入超过 31亿美元。 日月光封装测试（上海）有限公司为日月光集团合资子公司，位于上海浦东张江高科技园区，投资数亿美元建立了一个完整的封装设计、组装、测试厂区，并结合现有芯片制造商及IC设计公司，为客户提供一站式全方位产品及服务。 |
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