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1st EOS/ESD Manufacturing Symposium in China, November 15-18, 2016

已有 128 次阅读2016-10-26 13:27 |个人分类:ESD研讨会| 关键词: ESD, symposium

EOS/ESD Association, Inc. in cooperation with China National Institute of Standardization (CNIS), are organizing the 1st EOS/ESD Manufacturing Symposium in China. The EOS/ESD Manufacturing Symposium in China is focused on discussing the issues and providing the answers to electrostatic discharge in electronic production and assembly. The China National Institute of Standardization (CNIS) Workshop will be held in conjunction with this event.

TUESDAY, NOVEMBER 15, 2016

Grand Park Xian

8:00 – 10:00 REGISTRATION 

9:00 – 12:30 ESD Basics

Reinhold Gaertner, Infineon Technologies

13:30 – 17:00 Process Assessment

Reinhold Gaertner, Infineon Technologies 


WEDNESDAY, NOVEMBER 16, 2016 

Grand Park Xian

8:00 – 10:00 REGISTRATION 

9:00 – 17:00 ANSI/ESD S20.20 - Process Design Overview

John Kinnear, IBM 


THURSDAY, NOVEMBER 17, 2016

CNIS WORKSHOP WWW.ESD-CONF.ORG 

Tanglong International Hotel

For complimentary admittance to the CNIS workshop EOS/ESD Manufacturing Symposium attendees may RSVP by email to uschinasccp@ansi.org


FRIDAY, NOVEMBER 18, 2016

Grand Park Xian 

8:00 – 10:00 REGISTRATION

9:00 – 5:00 EXHIBITS OPEN

9:00 – 9:05 OPENING

9:05 – 9:30 Technical Presentation 1

Die Attached and Wire Bonder ESD Risk Assessment

Y.H. Goh, W.F. Wong, Mohamed Farhan bin Azmi, Mohamed Ibrahim s/o Badruddin, L.H. Koh, Everfeed Technology Pte., Ltd,

Abstracts:

ANSI/ESD SP10.1 acts as an ESD risk assessment guideline for test personnel to audit automated handling equipment. Two units each of die attached and wire bonder machine were audited. Additional ESD risk assessment considerations, on top of ANSI/ESD SP10.1, were proposed and discussed. 


9:30 – 9:55 Technical Presentation 2

Measurement Methods and Air Ionization Affected by Manufacturing Changes

Arnold Steinman, Electronics Workshop,

Dangelmayer Associates

Abstracts:

Manufacturing has brought increased semiconductor device functionality through smaller geometries, larger wafer sizes, and faster operating speeds, as well as increased disk drive storage density. It has also resulted in lower ESD withstand voltages for products. Measurements are needed to assure that the manufacturing process can safely handle these products. To produce these advanced technologies the use of air ionization for static control has changed. This paper explores measurement methods for process risk assessment and new ionization requirements.


9:55 – 10:20 Technical Presentation 3

Dummy Versus Live ESD Sensitive Devices Charge Analysis for Automated Handling Equipment ESD Qualification

Jeremy Ong, Bernard Chin, UTAC Headquarters Pte., Ltd.; L.H. Koh, Everfeed Technology Pte., Ltd, 

Abstracts:

Dummy units are commonly used for automated handling equipment (AHE) ESD qualification prior to releasing for production, due to resource limitations. Charge analysis for one hour vs 72 hours baking time for ESD sensitive devices (ESDS) were studied. This paper proposes live ESDS for AHE ESD qualification.


10:20 – 11:00 BREAK AND EXHIBITION

11:00 – 11:25 Technical Presentation 4

Factory ESD Grounding System Design Applications

Copper Hou, LEAN ESD Technology (Guangzhou) Co., Ltd.

Abstracts:

• This paper begins by demonstrating ESD control principles of ESD grounding and equipotential bonding, and derive what is effective or better ESD grounding system designs in an EPA. An equipotential based composite ESD grounding system practice is raised.

• Personnel electrical safety assurance is also demonstrated in relation with an ESD grounding system design. Several facility cases and issues related with ESD grounding are shared.

• Finally, this paper provides a clear design guideline for facilities especially in China to set up their appropriate ESD grounding system.


11:25 – 11:50 Technical Presentation 5

A Brief Analysis of Ground Resistance of ESD Systems in China 

Xiaorong Zhuang (Ghiang)

Abstracts:

At microelectronics super large-scale integrated circuits, the fine devices within can be broken down, with just a few volts of electrostatic micro-voltage, or be burnt the devices due to overcurrent. Therefore, as the demands of the information technology industry evolve, the problem of how to effectively control static charge accumulation and discharge in the production, storage, and transport of microelectronics continues to present new challenges. 


11:50 – 12:15 Technical Presentation 6

Pitfalls in ESD Control of Factories and Assembly Plants

Yalong Zhang, Qorvo (Beijing) Inc.

Abstracts:

In this presentation the author will share 3 case studies were ESD failures were observed in the factory. All of these were due to some type of ESD event occurring in a processing tool caused by a dynamic event. In most cases, the issue was not observed until parts with sensitivities of 125 to 250V HBM or 125 to 250V CDM were processed. In each case, a resolution was found for the problem but investigation was required to fully understand and address the issue.


12:15 – 13:30 LUNCH AND EXHIBITION


13:30 –13:55 Technical Presentation 7

Evaluation of ESD Garment with Conductive Ribbon

Bernard Chin, Jeremy Ong, UTAC Headquarters Pte., Ltd.; L.H. Koh, Y.H. Goh, Everfeed Technology Pte., Ltd. 

Abstracts:

A new batch of ESD garment (smock) was found to fail on compliance verification after 10 washes. An experiment was carried out to verify if smocks attached with conductive ribbon will have longer durability. This paper evaluates the durability of two types of smocks up to 110 and 420 washes.


13:55-14:40 Technical Presentation 8/9

Conducted EMI Measurements in Manufacturing Environment; EMI-Caused EOS Sources in Automated Equipment

Vladimir Kraz, OnFilter 

Abstracts:

High-frequency noise, or Electromagnetic Interference (EMI) in manufacturing environment has a potential of creating a number of problems, including:

• Equipment malfunctioning

• Errors in measurements

• Component damage

• Interference with wireless communication

Without proper measurements it is impossible to effectively control EMI

This paper describes basics of measurement of conducted EMI in manufacturing environment and EMI diagnostics. Due to limitations of time the focus is made on practical aspects of measurements, not on theoretical foundation.

• What is EOS and its importance

• EMI as a significant cause of EOS

• How does EMI turn into EOS

• EMI sources in automated equipment

• Acceptable EMI limits

• Mitigation of EMI-caused EOS


14:40 - 15:15 BREAK AND EXHIBITION

15:15 - 15:40 Technical Presentation 10

A Comparison Between ESD Protection Elements and ESD Countermeasure Material by Using Novel ESD Test System

Takayoshi Ohtsu, National Institute of Technology Numazu College; Kouichi Sagisaka, Yuka Denshi Co., Ltd. 

Abstracts:

The countermeasure technology in the system level is important for the next generation electric devices. The purpose of this study is to support the countermeasure technology in Factory level, Component level and System level using the developed observation system that ESD gun to protection element can observe Current waveform, Voltage waveform and Radiated electromagnetic

waveform.


15:40 - 16:05 Technical Presentation 11

Humidity Control Device for Static Charge Reduction 2

Albert Kow Kek Hing, ESD Consultancy Sdn., Bhd. 

Abstracts:

The RH static eliminator presented here is an advanced version to that presented in Singapore ESD Symposium 2012. The device comprises a moisture

generator and delivery system to eliminate/minimise static charges like a maintenance-free air ioniser. This novel device is readily scalable to multiple workstations hence achieving substantial cost advantage


16:05 - 16:15 CLOSING



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